Enhanced process development by simulation of ultrasonic heavy wire bonding / von Reinhard Schemmel, M. Sc. ; Referent: Prof. Dr.-Ing. habil. Walter Sextro, Korreferent: Prof. Dr.-Ing. habil. Gunter Kullmer. Paderborn, 2022
Inhalt
- Nomenclature
- Introduction
- State of the art
- Phenomenological description of the bond formation process
- Factors affecting bond quality
- Equipment and methods of process development in heavy wire bonding
- Modelling and simulation of the wire bond process
- Knowledge gap in ultrasonic heavy wire bonding
- Ultrasonic heavy wire bonding experiments
- Impact of the touchdown force
- Design of Experiment
- Impact of substructure resonances and bond frequency
- Multi scale model of the heavy wire bond process
- Model parameter identification
- Test rig for low frequency wire bonding experiments
- Coefficients of friction between tool, wire and substrate
- Bond formation model parameters
- Material behaviour of the bond wire under static and ultrasonic load
- Shear strength of the bond wire
- Tangential wire stiffness
- Overview of the model parameters
- Validation of the wire bond model
- Setup for the simulation
- Simulation of the parameter studies
- Additional simulation results
- Interpretation of the simulation results
- Conclusion and suggested future work
- Reference
- Appendix
- Additional shear codes from the wire bonding experiments
- Material properties for the modal analysis of the substrate model
- Program structure for high performance computing
- High performance computing results
- Literature values for the material parameters of aluminium an copper
- Control system of the test rig for identification of the model parameters
- Comparison between simulated and measured shear force values for bond model parameter identification
- Comparison between simulated and measured tool substrate contacts