Identification and simulation of critical interconnect paths with respect to transient noise on PCB-level / Mohamed Taki. 2008
Content
[2]blank
Promotion
[3]Aknowledgements
[5]Abstract
[11]Abbreviations and Symbols
Introduction
Susceptibility and Immunity of Electronic Devices
[23]EM Disturbances
Electromagnetic Interference Model
[24]Electromagnetic Interference Sources
Coupling Mechanisms
[25]Capacitive Coupling Paths
[25]Inductive Coupling Paths
[26]Crosstalk
[26]Galvanic Coupling Paths
[26]Radiation
[27]Victim Devices
Fast Transient Perturbations
[30]Electronic Device Sensitivity
[31]EMI Influence Parameters
Elements of a Noise Propagation Path at the PCB-Level
Assumptions to Reduction of Complexity
Passive Component Modeling
[37]Multiconductor Transmission Lines
[41]Transmission Line Discontinuities
[42]Passive Discrete Components
Nonlinear Component Modeling
[46]Analysis of a Complete Signal Propagation Path
Analysis Techniques of Large Circuits
Basic Circuit Analysis Techniques
[49]Nodal Admittance Analysis
[50]Connection Matrix Method
[54]Transfer Scattering Matrix Method
[59]Multiport Connection Method
Circuit Analysis by Signal Flow Graphs
Approach to Noise Path Tracing
Time Domain Analysis of a Complete Signal Path
Signal Path with a Linear Termination
Signal Path with a Nonlinear Termination
[96]Conventional Nonlinear Methods
[97]Harmonic Balance Technique
[101]Example of a Linear Load
[102]Example of a Passive Nonlinear Device
[107]Example of an Active Nonlinear Device
Investigation of Influence Parameters
[111]Signal Paths with Interconnects of Arbitrary Geometries
[115]Propagation of Noise Impulses from Multiple Sources
[120]Signal Propagation within Subcircuits
[123]Impact of Linear Interconnect Terminations
Implementation
[129]Conclusion
[131]Complex Fourier Series
[135]Some Fundamental Scattering Matrices
[137]References